Dr. Limei Cha joined GTIIT in 2018 as a senior research scientist and the manager of Electron Microscopy Center. She has a comprehensive background, both theoretically and experimentally, in the field of materials science and electron microscopy. Her research mainly focuses on using diverse advanced electron microscopy methods to investigate materials structures (down to subatomic level) and chemical compositions, and building up the interrelations between microstructure, chemical composition and properties of materials. Simulations may also be combined with experimental results to understand the specific characteristics of materials deeply. Besides alloys, thin films, intermetallics and energy materials investigated, research on biomaterials is envisaged in the future.
Limei Cha received her BSc from Tianjin University and MSc from Kunming University of Science and Technology, China. In 2003 she went to Max-Planck-Institute for Metal Research (MPI-MF), Stuttgart, Germany, where she studied materials science and electron microscopy in Prof. Ruehle’s group and earned her PhD. From 2006 to 2010, Dr. Cha started her postdoctoral research in University of Leoben in Austria, focusing on the correlation between microstructural and mechanical properties of TiAl alloys for 4 years. From 2011 to 2013, she joined Institute of Chemistry and Materials Science Paris East (ICMPE-CNRS) and Institute of Matériaux Jean Rouxel Nantes (IMN-CNRS) of France National Centre for Scientific Research, characterizing microstructures and analyzing interface development in steels and energy materials. Since 2014 Dr. Cha was employed as an associate professor in College of Materials Science and Engineering in Hunan University where she was awarded annual best supervisor for diploma theses in 2015. In addition to giving lectures on materials science and cooperating with several research groups, she spearheaded one project supported by National Natural Science Foundation of China (2015-2017). Moreover, she was also in charge of a project supported by Hunan Province (2016-2017), investigating interfacial structure features and evolution of solar cell films.
Interface and Surface
Intermetallics
Energy Materials
Electron Microscopy
Materials Characterization
Papers
L. Cha, S. Lartigue-Korinek, M. Walls and L. Mazerolles. Interface structure and chemistry in a novel steel-based composite Fe-TiB2 obtained by eutectic solidification, Acta Materialia 2012, (60) 6382-6389
Y. Qi, L. Cha*, X. Yang, W. Ming, S. Li; J. Han, Influences of the Selenization Temperature on the Microstructures and Chemical Compositions of CIGS/Mo Interface, Materials Research 2018 (11)
K. Fan; J. Guo; L. Cha*, Q. Chen, J. Ma*, Atomic layer deposition of ZnO onto Fe2O3 nanoplates for enhanced H2S sensing, Journal of Alloys and Compounds, 2017（698）336~340
J. Han, L. Xiao, L. Cha, J. Hamon, M. P. Besland, Investigation of oxide layer on CdTe film surface and its effect on the device performance, Materials Science in Semiconductor Processing, 2015 (40) 402~406
J. Han, C. Liao, L. Cha, T. Jiang, H. Xie, K. Zhao, M.-P. Beslanda, TEM and XPS studies on CdS/CIGS interfaces, Journal of Physics and Chemistry of Solids 2014, (75) 1279-1283
S．Lartigue-Korinek, M. Walls, N. Haneche, L. Cha, L. Mazerolles, F. Bonnet, Interfaces and defects in a successfully hot-rolled steel-based composite Fe–TiB2，Acta Materialia 2015, (98) 297–305
L. Cha, H. Clemens, G. Dehm, Z. Zhang. In-situ TEM heating study of the gama lamellae formation inside the α2 matrix of a Ti45Al-7.5Nb alloy, Advanced Materials Research 2010, (146-147) 1365-1368
L. Cha, T. Schmoelzer, Z. Zhang, S. Mayer, H. Clemens, P.Staron, G. Dehm. In-situ study of g-TiAl lamellae formation in supersaturated α2-Ti3Al grains. Advanced Engineering Materials , 2012, 14(5) 299–303
L. Cha, C. Scheu, H. Clemens, H. F. Chladil, G. Dehm, R. Gerling, A. Bartels. Nanometer scaled lamellar microstructures in Ti–45Al–7.5Nb–(0; 0.5)C alloys and their influence on hardness. Intermetallics, 2008, (16) 868-875
L. Cha, C. Scheu, G. Richter, T. Wagner, S. Sturm, M. Rühle. First observation of a hexagonal close packed metastable intermetallic phase between Cu and Al bilayer films. International Journal of Materials Research, 2007, (98) 692-699
